PRODUCTS
Current product：Polyimide
Polyimide
This series features polyimide varnishes and polyamide-imide adhesives with high Tg, low dielectric loss, and good processability—ideal for FCCL, high-frequency circuits, and low-temp lamination in advanced electronics.
High Tg PI varnish (high Mw)
SpecificationTg 280oC; NMP; Solid content 11-12%
Description
A universal soluble Polyimide varnish with good solvent solubility and processability. It has a high molecular weight and has high elongation due to its flexible molecular structure. Excellent insulation and flame retardancy allow it to be used in a variety of applications.
High Tg PI Varnish (Low Mw)
SpecificationTg 280oC; NMP/DMAc; Soild content 35-38%
Description
It has a small molecular weight and good leveling properties, and can be used in formulas with epoxy or other ingredients.
Low Df PI Varnish
SpecificationDk 2.6, Df 0.0016 at 10 GHz
Description
Soluble PI resin with low Dk and Df characteristics. Reacts with epoxy to achieve excellent heat resistance and peel strength. This product is used as a key raw material for high-frequency adhesives.
