Low Cl-
Hy-Cl below 200ppm, Total Cl below 700ppm, viscosity (cps at 25oC) below 5000. Used in semiconductors, PCBs, conductive adhesives, LEDs.
Ultra low Cl -
Hy-Cl below 30ppm, Total chlorine below 200ppm, viscosity (cps at 25oC) below 5000. Used in semiconductors, conductive adhesives.
Hy-Cl below 200ppm, total Cl below 700ppm, viscosity (cps at 25oC) below 3000. Used in semiconductors, PCBs, conductive adhesives, LEDs.
Viscosity(cps 25oC) 200-400, Hy-Cl (ppm) 1000 max, Total Cl (ppm) 3000 max
Hy-Cl below 200ppm, viscosity (cps at 25oC) below 3000. Used in semiconductors, PCBs, conductive adhesives, LEDs.
Hy-Cl is less than 350ppm, high Tg, low CTE. Suitable for EMC, laminates, etc. that require good electrical characteristics.
CTBN-modified epoxy resin is semi-solid and exhibits excellent adhesion and impact toughness, making it particularly suitable for advanced composite materials that require enhanced toughness and durability. Its outstanding performance ensures stability and reliability even under external forces or vibrations.
CSR-modified epoxy resin has a viscosity range of 20,000–50,000 cps or 90,000–150,000 cps and demonstrates superior flexibility, adhesive strength, peel strength, impact resistance, fracture toughness, elastic modulus, shear strength, and tensile strength. It is ideal for structural adhesives, electronic packaging, and other high-performance bonding applications, effectively enhancing overall strength and durability of components.
It does not debond at high temperatures, the refractive index is 1.62, and Hy-Cl is less than 350ppm. Suitable for laminates, packaging grinding, and LED packaging.
Biphenyl-phenylene-based epoxy resins feature low dielectric constant (Dk) and low dielectric loss (Df), while also exhibiting low water absorption and high adhesion. These properties effectively enhance signal stability and insulation performance of electronic materials in high-frequency environments. After curing, this type of epoxy resin demonstrates excellent thermal resistance and dimensional stability, making it particularly suitable for applications requiring low dielectric properties and high reliability, such as high-frequency printed circuit boards, advanced packaging, and electronic substrates.
EEW: 265–285 / 280–300
Softening point (°C): 53–63 / 65–75
High heat-resistant epoxy resins feature excellent thermal stability and a low coefficient of thermal expansion (CTE), effectively enhancing dimensional stability in high-temperature environments. Their low modulus at elevated temperatures helps reduce interfacial stress caused by thermal cycling. These epoxies are widely used in electronic materials, composites, as well as encapsulation and bonding applications that require high-temperature resistance, providing an important solution for improving product reliability under thermal stress.
Cured with phenol novolac: CTE (50–250 °C, %): 0.8–2; Tg (DMA, °C): 220–240.
