INDUSTRIES
Electroplating Process
With the increasingly stringent heavy metal discharge standards, the electroplating industry is also facing higher threshold treatment requirements. How to refine the wastewater...
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Dyeing and Finishing
The main problem of dyeing and finishing wastewater is that there are a lot of residual dyes and organic matter in the water, and how to effectively reduce COD and color is an u...
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Printed Circuit Board (PCB)
Printed circuit board copper-containing wastewater is the largest amount, and it is an important issue to meet the 110-year copper standard of less than 1.5ppm.
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Wafer Dicing Backwash (CMP)
There are fine particles in wafer dicing and grinding wastewater, how to reduce the particles is a common problem.
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CCL(Copper Clad Laminate)
Low Dk/Df, low CTE, halogen-free, flame retardant, low chlorine and environmental protection are the development direction of CCL industry.
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Semiconductor Assembly
Solid molding materials and liquid molding materials are mainly composed of epoxy resin, phenolic resin, catalyst, silicon dioxide. powder(fillers), etc.
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Ink&Coating
Functional products such as thermal insulation,thermal dissipation、 low dielectric, low CTE,anti-reflection and biomass are the main development points by various manufacturers.
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