Spherical silicon dioxide (Silica), the particle size is nano/micron scale;
Titanium dioxide(Titania) , the particle size is nano/submicron scale;
Spherical Aluminium oxide(Alumina), the particle size is nano/submicron/micron scale;
Hollow Silica , the particle size is nano/submicron;
High-purity Magnisium oxide, the particle size is nano-scale;
High-purity Copper oxide, the particle size is nano-scale;
High-purity Yttrium oxide, the particle size is nano-scale;
There are also other surface treated products, welcome to leave a message or call for specifications.
1) Excellent fluidity and dispersibility 2) Easy to handle 3) High crystallinity and high purity 4) Primary particle size 200-300nm;Main application-sintering aids, thermal conductivity additives, anti-scratch and wear-resistant films
1) Excellent fluidity and dispersibility 2) Easy to handle 3) High crystallinity and high purity 4) Primary particle size 300-400nm;Main application-sintering aids, thermal conductivity additives, anti-scratch and wear-resistant films
The primary particle size is 30nm, applications: anti-sticking, scratch-resistant and impact-resistant, insulation
High heat insulation, low Dk, low reflection, low scattering, low refractive index, high frictional resistance and other characteristics; primary particle size is 70nm
High heat insulation, low Dk, low reflection, low scattering, low refractive index, high frictional resistance and other characteristics; primary particle size is 700nm
High heat insulation, low Dk, low reflection, primary particle size is 70nm
1) Low coefficient of thermal expansion (CTE), which can reduce the CTE of the material and prevent material cracking 2) Low dielectric loss (Low Df) 3) Anti-warping, high filling content 4) Low radiation 6) Spherical material has better fluidity and filling 7) The average particle size is 50nm
1) Low coefficient of thermal expansion (CTE), which can reduce the CTE of the material and prevent material cracking 2) Low dielectric loss (Low Df) 3) Anti-warping, high filling content 4) Low radiation 6) Spherical material has better fluidity and filling 7) The average particle size is 200nm
1) Low coefficient of thermal expansion (CTE), which can reduce the CTE of the material and prevent material cracking 2) Low dielectric loss (Low Df) 3) Anti-warping, high filling content 4) Low radiation 6) Spherical material has better fluidity and filling 7) The average particle size is 500nm
1) High purity 2) High whiteness 3) Uniform and extremely fine particle size, primary particle size is 15nm
1) High purity 2) High whiteness 3) Uniform and extremely fine particle size, average particle size is 300nm 4) Surface treatment, excellent water dispersibility 5) Crystal form is Anatase
1) Particles are spherical, with excellent fluidity and dispersibility 2) Easy to disperse 3) High crystallinity, high purity 4) D50=2um
1) Particles are spherical, with excellent fluidity and dispersibility 2) Easy to disperse 3) High crystallinity, high purity 4) D50=71um
1) The particles are near-spherical, with excellent fluidity and dispersion 2) Easier to handle than other nanoparticles 3) High crystallinity and high purity 4) Surface treatment 5) It could replace Titanium dioxide and is an environmentally friendly material 6)Primary size is 30nm 7) Suitable for perovskite solar energy transport layer and toner external additives.
1) Small particle size (average particle size: 20-50nm) 2) Dispersible (to overcome the shortcomings of nanomaterials) 3) High crystallinity, high purity 4) Good fluidity (spherical); main application - ceramic sintering aid , polishing agent, improve scratch resistance of paints and coatings (hard coat), improve adhesion to substrate, improve heat radiation
1) Small particle size (average particle size: 20-50nm) 2) Dispersible (to overcome the shortcomings of nanomaterials) 3) High crystallinity, high purity 4) Good fluidity (spherical); main application - ceramic sintering aid ,electronic components such as capacitors
1) Small particle size (average particle size: 20-50nm) 2) Dispersible (to overcome the shortcomings of nanomaterials) 3) High crystallinity, high purity 4) Good fluidity; main applications - conductive paste, electronic component materials, For example: phenolic resin and thermistor
1) Small particle size (average particle size: 20-50nm) 2) Dispersible (to overcome the shortcomings of nanomaterials) 3) High crystallinity, high purity 4) Good fluidity; main applications - sintering aids for ceramics, electronics components such as: capacitors, glass protective films for lamps