Introduction of key material trends in CCL resin formulations!!

Kelly chemical provides a variety of CCL materials for different applications, which can meet your needs for multiple materials at once!

            

    The process of manufacturing PCB mainly includes: front-end production of CCL, inner layer circuit production, lamination, through hole and outer layer circuit manufacturing, solder mask and surface treatment and other steps. Among them, the manufacture of CCL is the basis and key technology of printed circuit boards. CCL can use various materials such as insulating paper, glass fiber or other fiber materials as reinforcing materials. At present, the mainstream material is electronic grade glass fiber. The production process is to combine multiple layers of glass fiber impregnated with resin. Also known as resin raw film or prepreg for short, it is called laminated board, which is made by coating copper foil on one or both sides under high temperature and high pressure. Among them, the resin formula is the key to affect the grade and quality of PCB.
 
    Since the composition of glass fiber CCL is mainly composed of glass fiber impregnated into the formula of resin + filler to become a high Tg (glass transition temperature of the plate), high heat resistance and low dielectric constant prepreg material (Prepreg), Or a base material for packaging substrates with low CTE and high performance. In order to meet the requirements of downstream high-end product specifications, in recent years, the specifications of CCL have been divided into: glass fiber CCL for general use, CCL for High Tg, CCL for carrier board, and CCL for high-frequency/high-speed board, etc. Four categories.

A brief introduction to the current market trend of formulation materials-

Resin-

low Dk epoxy resin, halogen-free flame-retardant epoxy resin(Further reading:Bio epoxy resin, green, low-carbon, environmentally friendly materials that meet the trend!! ),

biomass epoxy resin, core-shell toughened epoxy resin,(Further reading:Toughened epoxy resin-CSR core-shell technology to solves the problem of brittleness!!) 

low Dk PPO(PPE) resin, low-halogen epoxy resin(Further reading:Low chlorine epoxy resin (1): Characteristics commonly used in product development in the electronic and electrical fields!! )

Filler-

Spherical silica: nanoscale, micron scale

Very low CTE, improved warpage problem, low Dk, improved dimensional stability
Suitable for IC substrate (ABF), high Tg substrate development

(Further reading:Spherical silica(SiO2) is the best choice for semiconductor packaging and CCL fillers!! )

Hollow glass beads: micron scale

Low Dk, low CTE, reduced resin usage, improved warpage, lightweight
Suitable for high-frequency and high-speed substrate development
(Further reading:What are the suitable materials for Low K product development? Hollow glass beads meet your needs!! )

Hollow silica: micron scale

Low Dk, low CTE, reduced resin usage, improved warpage, light weight, extremely small particle size
Suitable for development of high-frequency high-speed substrates and multilayer substrates

(Further reading:Nano hollow silica(SiO2)-5G Low K, heat insulation, low reflection AR film material )

Spherical Alumina: micron scale

Economical heat dissipation, improved flame retardancy
Suitable for common FR-4 substrate development
(Further reading:What are the advantages of spherical Alumina(Al2O3) in heat dissipation applications? Let you know it once! )

Spherical Aluminum Nitride: micron scale

High thermal dissipation
Suitable for thermal substrate development

Spherical Titania: submicron scale

High whiteness, can greatly improve light reflectivity
Suitable for white substrate development

(Further reading:High purity Titanium(TiO2) has the advantages of high refractive index, high reflection, high whiteness, and high transparency!! )

Fillers can do surface treatment according to different resins to improve dispersibility!!

#bio-epoxy #low K #low CTE #CCL #Environmental friendly #ABF #CSR #high dissipation #PPO