Nano hollow silica(SiO2)-5G Low K, heat insulation, low reflection AR film material

Looking to improve the dielectric constant of your product? While low-dielectric resins can be used, their effectiveness may not suffice. Conventional hollow spheres often face issues such as oversized particle diameters, fragility, and poor heat resistance. In this regard, nano hollow silica could be an excellent material choice for you~

 

At Kelly Chemicals, we offer nano/micron-sized hollow silica materials and assist in resolving customer dispersion issues. Feel free to contact us for product inquiries.

 

  

 

Nano Hollow Silica

 

Currently, developers of 5G materials utilizing resins are actively pursuing research on low-dielectric materials. However, relying solely on resin has its limitations. Therefore, fillers with hollow structures, inherently possessing low dielectric properties due to internal air, emerge as the optimal choice of materials. With the demand for multilayered PCBs and miniaturized thin films, filler sizes ideally need to be below 5 μm, with thicknesses ranging from 25 to 100 μm or even lower. However, the main drawback of hollow glass/plastic spheres lies in their manufacturing constraints, limiting the smallest achievable size to around 10 μm. Additionally, their softening point is below 600°C, rendering them unsuitable for certain electronic applications. In contrast, hollow silica nanoparticles boast controlled particle sizes below 1 μm, even reaching 50 nm, with excellent temperature resistance up to 1200°C. They are crucial materials for the development of emerging technologies such as 5G, metaverse, and automotive applications.

 

Hollow silica's internal hollow structure contributes to lightweighting and provides thermal insulation. Consequently, it has become increasingly popular in applications such as thermal insulation coatings, rubber, and adhesive fillers. Hollow silica is expected to replace silicon dioxide fillers used in electronic substrates such as copper foil substrates (CCL) or FCCL for 5G applications.

 

(Extended Reading:What are the suitable materials for Low K product development? Hollow glass beads meet your needs!!)

 

Features-

 

1.Truly spherical

2.Inert and safe material

3.Extremely low density

4.Low specific surface area (BET)

5.Low dielectric constant

6.Low dielectric loss

7.Good compatibility with PI and LCP

8.High strength

9.Low moisture absorption

10.Low refractive index

 

Applications-

 

1.Fillers for 5G substrates (FCCL/Rigid PCB)

2.Adhesive fillers with low dielectric constant and low dielectric loss characteristics at 10 GHz

3.Electronic materials, heat-resistant low dielectric insulation films

4.Optical materials, diffusion films/AR films

5.High-performance insulation, transparent insulating films

 

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