2026.08.17

Fluorinated acrylic materials: a key formulation for creating next-generation semiconductor and electronic materials

2026.08.17

1,4-Cyclohexanedimethanol Diglycidyl Ether: Properties and Applications in Semiconductor Packaging and Optical Adhesives

2026.08.17

The Rise of Low-Temperature Sintered Copper Powder: Revolutionary Material for Semiconductor Packaging and Printed Electronics

2026.07.21

TGMXDA Epoxy: High Performance, Easy Processing

2026.07.20

What is Glass Frit? Everything You Need to Know About Its Applications and How to Choose the Right Material!

2026.07.20

Towards High Frequency and High Speed: Low Dk Material Formulation Design Guide

2026.06.17

A key driver of the high-frequency, high-speed era: Exploring new frontiers in Low Dk thermoplastic and elastomer materials.

2026.06.16

Methacrylate-Modified Resin for High-Frequency Communication Materials: Improving CCL Adhesion and Low-Dielectric Performance

2026.05.27

Applications of ultrathin copper foil in high-end electronic and semiconductor packaging

2026.05.26

Silane-Modified Epoxy Resin: A Key Material for Enhancing Adhesion to Glass and Metal