Behind Every High-Speed System Is the Right Material Choice

 

In the past, the product development mainly focused on thermal stability, mechanical strength, and processing efficiency. However, as AI, cloud computing, data centers, and 5g/6g technologies are booming, the information flow grows exponentially. The challenges electric products faced have changed significantly. Now, the core issue appears: the speed will go on being faster and faster, but the signal should never drop the ball during the transmission.

Especially in high-frequency transmission, the dielectric properties of the material itself have become a key factor in determining product performance. Therefore, resins with low dielectric constant (low-Dk) and low dielectric loss (low-Df) are seen as important solution for driving the advancement of next-generation electronic products.

 

 

 

 

I. Why is low-Dk so important?

 

At GHz-level high-speed transmission, signals travel at extreme speeds, akin to race cars speeding down a highway. Any resistance can cause delays or energy loss.

 

Therefore, materials must exhibit the following characteristics:

• Low Dk → faster signal transmission
• Low Df → reduced signal attenuation and more stable signal quality

 

At higher frequencies, performance gaps widen, driving a sharp increase in market demand for low-Dk/Df materials.

 

However, being able to "transmit fast" does not guarantee the ability to "transmit reliably over time". High-speed materials are faced with:

• Thermal cycling caused by multiple reflow soldering processes
• Thermal stress induced by high power density
• Dimensional changes resulting from stacked packaging structures
• Long-term vibration and temperature fluctuations in automotive environments

 

The low-Dk materials that can truly be adopted for mass production must simultaneously offer:

✔ Excellent electrical performance

✔ High heat resistance (high Tg)

✔ Long-term reliability

✔ Process and manufacturing compatibility

 

This is precisely why low-Dk resins stand out.

 

 

II. Application Areas: From High-Speed PCBs to Advanced Packaging:

 

As the scope of high-speed applications rapidly expands, low-Dk resins are simultaneously enabling two major core domains:

 

Application Area	Key Challenges	Improvements Enabled by Materials
AI/HPC servers & data centers	Massive high-speed signal transmission	Reduced signal loss; enhanced bandwidth and performance
Advanced packaging (ABF / SiP / WLP)	Interfacial failure caused by thermal expansion and warpage	Improved adhesion; enhanced structural reliability
5G/6G communications & base stations	Long-distance and high-frequency synchronization requirements	Maintained signal integrity and low latency
Automotive radar / ADAS	Prolonged high-temperature operation and vibration	Extended service life; prevention of package fatigue degradation
Networking switches & routers	Stability of high-speed connections	Reduced noise and insertion loss

 

From server motherboards to chip-level packaging, low-dielectric resins deliver significant performance improvements.

 

 

III. Differentiation Compared to Existing Materials

 

Low-dielectric materials are not meant to replace existing resins—they are the ideal partners for design upgrades:

 

Material	Advantages	Limitations	Primary Positioning
BT resin	Excellent heat resistance; mature supply chain	Higher signal attenuation at high speed	Traditional substrates
PPE resin	Good high-frequency performance	Adhesion and processing challenges	High-speed PCB applications
DCPD resin	Low cost	Average thermal and electrical properties	Entry-level high-speed applications
Low-dielectric resin	Leading electrical performance; consistent reliability	Medium-to-high cost	Core choice for high-speed PCBs + advanced packaging

 

In other words:
When products start demanding high speed and high frequency, low-dielectric resins become a necessary choice.

Especially with the rapid upgrade of AI and high-speed networking requirements, even slight signal attenuation can directly impact performance and shipment specifications.
Therefore, upgrading materials is often the first step for companies to gain a market edge.

 

 

IV. Benefits of Adoption: Not Just a Bonus, but a Baseline

 

By adopting low-dielectric resins, companies can achieve:

 

Benefit Area	Specific Outcomes
Performance	Higher high-frequency speed; improved signal integrity
Product Quality	Longer service life; improved packaging and substrate yield
Market Competitiveness	Easier entry into high-end supply chains and mainstream design specifications
Risk & Cost	Reduced hidden costs from rework and reliability failures
Brand Recognition	Demonstrates forward-looking technological investment and upgrade strategy

 

This is no longer a premium option—it is a strategic move to preserve future competitiveness.

 

 

Conclusion: Next-Generation Product Upgrades Begin with Material Selection

 

High-speed electronic design is entering a new wave of innovation, and materials serve as the fundamental switch to kickstart this upgrade.

 

Low-dielectric resins have garnered attention because they:

 

✔ Enhance high-speed transmission performance
✔ Maintain signal integrity at high frequencies
✔ Remain compatible with demanding manufacturing processes
✔ Provide long-term reliability assurance

 

They are redefining product performance from substrates to packaging. In a market where the pace of competition continues to accelerate, mastering this material technology represents the best opportunity to stay ahead in next-generation product development.