Are you still using isopropanol (IPA) for cleaning?

 

After careful analysis, IPA may not necessarily be the best solution!

 

 

In recent years, due to the COVID-19 pandemic, alcohol has been in high demand, and IPA has become one of the popular options for disinfection, providing people with initial understanding of this chemical. IPA, due to its easy availability, low cost, and fast drying properties, it is commonly used as an additive in cleaning products and directly in electronic industry cleaning processes. Apart from IPA, ethanol and acetone are also common cleaning solvents used in factories.

 

However, despite its widespread use, IPA also poses risks of high volatility and flammability. Moreover, in some cleaning tasks, it does not offer superior cleaning power. In comparison, water-based formula cleaning agents, such as FT 300, offer fast drying, low residue cleaning, while avoiding the risk of flammability associated with IPA. FT 300 can replace IPA for cleaning solder paste on SMT process stencils, offering fast drying and low residue.

 

Comparison of commonly used solvent physical properties:

 

	Isopropanol (IPA)	Alcohol (Ethyl Alcohol)	Acetone	FT 300
GHS Label				None
Transport Category	Class 3 Flammable Liquid	Class 3 Flammable Liquid	Class 3 Flammable Liquid	Ordinary Product
Flash Point (°C)	12	13.9	-17	40
VOC(Wt%, EC)	100	100	100	18.9

 

Applicable Materials:

 

	Isopropanol (IPA)	Alcohol (Ethyl Alcohol)	Acetone	FT 300
ABS	O	△	X	O
HDPE	O	O	O	O
PVDF	O	O	X	O
Acrylic	X	X	X	O

 

 

SMT Stencil Solder Paste Cleaning

 

FT 300 Cleaning Agent (IPA Substitute)

 

A fast-drying cleaning agent without surfactants, used to remove solder paste residues on stencils, squeegees, and other work equipment. Dust, fingerprints, and oil stains will also be removed. Suitable for automatic stencil cleaning at the bottom. Manual cleaning tools, squeegees, scrapers, and stencils.

 

 

(Extended Reading:Alternatives of Naphtha cleaner, water-based and environmentally friendly formula ~ BIO-CIRCLE FT series quick-drying solvent substitute !!)

 

SMT Reflow Soldering Furnace Cleaning

 

UNO S V Furnace Cleaning Agent (Spray Foam)

 

A phosphate-free, highly concentrated cleaning agent (ready-to-use type) used to remove burnt flux, solder paste, smoke residue, and other residues from reflow and wave soldering systems. The residual heat of the soldering furnace can be used to assist in cleaning, shortening the time.

 

 

SMT Reflow Soldering Flux Cleaning

 

ALUSTAR 200 Flux Cleaning Agent

 

A professional, fluid, highly alkaline cleaning agent developed to remove flux residues, condensate valves, solder frames, carriers, etc. from wave soldering equipment. Shorter cleaning time ensures rapid recovery of cleaned production facilities. Suitable for general-purpose, manual and mechanical use, with an ideal cleaning temperature of 65°C.

 

 

Advantages:

 

• Low foam
• VOC-free
• Can also be used in soaking baths, ultrasonic cleaning equipment, and manual cleaning (dilute 1:20 to 1:40).
• Effectively removes oil, grease, dust, and other contaminants from tools and machine parts.
• Highly concentrated - application concentration starts from 0.5%.

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Anti-Static Floor Cleaning

 

UNO S F Cleaning Agent (Anti-Static Surface)

 

A phosphate-free, water-based alkaline cleaning agent with a foam-free formula. Highly concentrated, dilutable with water up to 1:40. Used for cleaning floors, enclosures, and other surfaces. Dissolves oil, grease, dust, solder paste, flux residues powerfully, and has anti-static properties. Can be used with high-pressure water guns, floor scrubbers, or manual cleaning.

 

 

Advantages:

 

• Removes oil, grease, release agents, smoke, burnt dirt, etc.
• Cleans steel, stainless steel, ceramics, plastics, etc.
• Very economical, see mixing ratio.
• Application Long service life, compatible with oil separators.